Accordingly, Mate 50 and P60 will be announced this year.

What's confirmed for Mate 50:

1. M50 support 5G, domestic RF chip in 14 nm.
2. CPU is still Kirin 9000, last batch produced by TSMC.
3. Qualcomm 5G chip will be procurred.
4. If US ban Qualcomm, then only Kirin 9000 version will support 5G. Qualcomm version limited to 4G.

P60 said to be schedule for winter announcement.

1. New CPU, new Kirin. Code name yet to finalize.
2. 14 nm domestic fabrication in multi-layer stacks. It will have more transistor count than the 5 nm Kirin's 15.3 billion transistors fabricated with EUV lithography.
3. Performance is expected to be neither better or worse.
4. Put a lot of effort into heat dissipation.
5. Domestic 14 nm stacking result in high cost. Price won't be low.
6. New Kirin has a very powerful GPU, not a Mali GPU such as the ARM Mali-G78 MP24 in current Kirin 9000, it's a self developed GPU.
7. First smartphone entirely using Huawei's own components, from CPU, GPU to 5G RF chip. All content are authentic Made in China.

So basically this new multi-layer Kirin chip in 14 nm is roughly as powerful as the Kirin 9000 produced in 5 nm process. It's obvious the use of multi-layer stacking in 14 nm is an interim solution due to lack of 5 nm process. The long term solution is for Chinese fabs such as SMIC to achieve breakthrough in 7 nm and below process. Getting rid of TW mole Chiang Shang-Yi will clear the obstacle in SMIC to focus R&D on advanced process.